|
emporary mounting
adhesive
TYPICAL APPLICATIONS
* Polishing and lapping single crystals, optical
components and ceramics.
* Dicing and scribing crystals, glasses,
piezoelectrics, semiconductors and metals.
* Machining ceramics, glass,
refractories and metals.
* Temporarily mounting substrates for electron
microscopy.
EZ-Bond temporary mounting
adhesive is a non-hazardous material ideal for temporarily mounting materials
that require polishing, dicing, scribing and other machining processes. EZ-BOND
exhibits high bond strength and adheres readily to metals, ceramics, composites,
and glass. The adhesive is easily removed by reheating to its re-flow
temperature of 125 ºC, and removing the residue in alcohol. EZ-BOND is available
in standard size sticks, ½” x ½” x 6”, and other sizes can be supplied upon
request.
EZ-BOND
PROPERTIES
|
Property |
Units |
Value |
|
Softening
Point |
ºC
|
115 -
125 |
|
Color |
|
50% in
n-propanol |
|
Gardner 6 Melt
viscosity |
Brookfield, cps at
160 ºC |
600 |
|
Acid
Number |
|
3 |
|
Amine
Number |
|
3 |
|
Ethanol
Solubility |
% Solids at Haze
Point: In Anhydrous Denatured Ethanol |
7 |
|
|
In 190 proof
Denatured Ethanol |
26 |
|
Flash
Point |
ºC |
319 (605
ºF) |
APPLICATION PROCEDURES
1) Heat a ceramic or glass mounting block to
the flow temperature of EZ-BOND
(115-125 ºC)
using a hot plate or oven.
2) Apply a layer of EZ-BOND to the heated mounting
plate and place the substrate over the adhesive. Apply
pressure evenly to the substrate to remove entrapped air. Allow EZ-BOND to flow
around the perimeter of the substrate to increase the holding strength.
3)
Remove the assembly from the heat source and allow it to cool slowly to room
temperature until the adhesive is hardened.
4) To remove the parts, re-heat
the assembly to 115-125 ºC. Use a tool to slide the substrate off, and rinse
thoroughly in ethanol to remove all residue.
|
